Compared to standard copper (99.9 %), ultra‑pure grades offer:
Thermal conductivity
≥ 400 W/(m·K) at room temperature;
Critical for heat management applications.
Mechanical properties
Tensile strength: 200–250 MPa (annealed);
Elongation: 40–50 %;
Excellent formability and weldability.
Chemical stability
Minimal oxidation in normal environments;
Low outgassing in vacuum (critical for space/UHV applications).
Microstructure
Large, uniform grains;
No inclusions or segregations.